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Title
Method for inhibiting Sn whisker growth on Ti2SnC
Authors
Keywords
-
Journal
JOURNAL OF MATERIALS SCIENCE
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2022-11-01
DOI
10.1007/s10853-022-07867-5
References
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Related references
Note: Only part of the references are listed.- Rapid and massive growth of tin whisker on mechanochemically decomposed Ti2SnC
- (2022) Qianqian Zhang et al. Materials Today Communications
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- (2020) Jingwen Tang et al. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
- The effect of Bi addition on the formation of metal whiskers in Ti2SnC/Sn-xBi system
- (2020) Yan Zhang et al. VACUUM
- Isotope study reveals atomic motion mechanism for the formation of metal whiskers in MAX phase
- (2020) Chengjie Lu et al. ACTA MATERIALIA
- Preparation and arc erosion properties of Ag/Ti2SnC composites under electric arc discharging
- (2019) Jianxiang Ding et al. Journal of Advanced Ceramics
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- (2019) Matheus A. Tunes et al. ACTA MATERIALIA
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- Mechanism and mitigation of spontaneous Ga whisker growth on Cr2GaC
- (2019) PeiGen Zhang et al. Science China-Technological Sciences
- Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints
- (2019) Peng Xue et al. Applied Sciences-Basel
- Mechanisms behind the spontaneous growth of Tin whiskers on the Ti2SnC ceramics
- (2019) Yushuang Liu et al. ACTA MATERIALIA
- Evidence of 3D strain gradients associated with tin whisker growth
- (2018) Johan Hektor et al. SCRIPTA MATERIALIA
- Spontaneous Sn whisker formation on Ti2SnC
- (2017) Y. Liu et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments
- (2017) Jie Wu et al. MICROELECTRONICS RELIABILITY
- Chemical bonding and electronic-structure in MAX phases as viewed by X-ray spectroscopy and density functional theory
- (2017) Martin Magnuson et al. THIN SOLID FILMS
- Alloying effects on structural, magnetic, and electrical/thermal transport properties in MAX-phase Cr 2−x M x GeC ( M = Ti, V, Mn, Fe, and Mo)
- (2016) Shuai Lin et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Room temperature mushrooming of gallium wires and its growth mechanism
- (2015) P. Zhang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review
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- Whisker growth in Sn and SnPb thin films under electromigration
- (2014) Wei Zhou et al. VACUUM
- Mitigation of Sn Whisker Growth by Small Bi Additions
- (2013) Jung-Lae Jo et al. JOURNAL OF ELECTRONIC MATERIALS
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