Phase change material/heat pipe and Copper foam-based heat sinks for thermal management of electronic systems

Title
Phase change material/heat pipe and Copper foam-based heat sinks for thermal management of electronic systems
Authors
Keywords
Phase change material, Heat pipe, Metallic foams, Thermal management
Journal
Journal of Energy Storage
Volume 32, Issue -, Pages 101971
Publisher
Elsevier BV
Online
2020-10-17
DOI
10.1016/j.est.2020.101971

Ask authors/readers for more resources

Reprint

Contact the author

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search