MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Note: The following journal information is for reference only. Please check the journal website for updated information prior to submission.
Journal Title
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
MAT SCI SEMICON PROC
ISSN / eISSN
1369-8001
Aims and Scope
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
Subject Area
ENGINEERING, ELECTRICAL & ELECTRONIC
MATERIALS SCIENCE, MULTIDISCIPLINARY
PHYSICS, APPLIED
CiteScore
7.00
View Trend
CiteScore Ranking
| Category | Quartile | Rank |
|---|---|---|
| Engineering - Mechanical Engineering | Q1 | #94/631 |
| Engineering - Condensed Matter Physics | Q1 | #68/423 |
| Engineering - Mechanics of Materials | Q1 | #66/391 |
| Engineering - General Materials Science | Q1 | #105/453 |
Web of Science Core Collection
| Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
|---|---|
| Indexed | - |
| Category (Journal Citation Reports 2023) | Quartile |
|---|---|
| ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE | Q2 |
| MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE | Q2 |
| PHYSICS, APPLIED - SCIE | Q2 |
| PHYSICS, CONDENSED MATTER - SCIE | Q2 |
H-index
49
Country/Area of Publication
ENGLAND
Publisher
Elsevier Ltd
Publication Frequency
Bimonthly
Annual Article Volume
706
Open Access
NO
Contact
ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
Verified Reviews
4.18 with editor
4.19 with editor
4.28 under review Review invitations sent: 4
4.29 under review Review invitations accepted: 1
5.5 reviewed completed: 1
5.8 invitations sent: 4+3
5.9 invitations accepted: 2
5.18 reviewed completed: 2
5.20 revise (reviewed completed: 3) Due on June 10
6.3 revise submission
6.6 required review completed (2)
6.6 under review
6.11 Required Reviews Complete 3
3.12 Accepted
Translation:
4.15 JAC transfer submitted
4.18 with editor
4.19 with editor
4.28 under review Review invitations sent: 4
4.29 under review Review invitations accepted: 1
5.5 reviewed completed: 1
5.8 invitations sent: 4+3
5.9 invitations accepted: 2
5.18 reviewed completed: 2
5.20 revise (reviewed completed: 3) Due on June 10
6.3 revise submission
6.6 required review completed (2)
6.6 under review
6.11 Required Reviews Complete 3
3.12 Accepted
2023.04.17 Received reviewer comments, all three reviewers suggest major revisions
2023.05.28 Submitted revised version
2023.06.14 Received reviewer comments, two reviewers suggest minor revisions, while one suggests acceptance
2023.06.26 Submitted revised version
2023.06.27 Accepted
Overall, the reviewing process and editorial handling were very fast, and the reviewers were also very professional, greatly helping to improve the overall quality of the article.
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